Understanding the development and distribution of residuals stresses (RS) during manufacturing is a key factor in the development of methods to minimise distortions in components during machining.


The Residual Stress Measurement Group at the AMRC has interest in investigating the factors that influence
the generation and distribution of residual stresses (RS) in manufacturing processes, including:

• Development of an understanding of the factors that influence the generation and distribution of RS during heat treatment
• Effect of process variability on RS
• Machining-induced stresses
• Influence of RS on machining distortions
• Interaction of near and bulk RS
• Validation of process models in-house for RS predictions


Portable X-ray Diffraction System (XRD) - X-ray diffraction can be used to measure residual stress using the distance between crystallographic planes, i.e., d-spacing, as a strain gage.

Ultrasonic Stress Measurement System - The portable, semi-automatic device for Ultrasonic Measurements of Applied and Residual Stress is designed for measurement of bulk and surface residual and applied stresses in samples, parts, welded elements and structures non-destructively.

Contour Measurement Technique - Contour measurements are used to measure bulk residual stresses. Contour measurement is performed as following: 1) EDM machine; 2) CMM machine and 3) FE Modelling.

For more information, please contact: