Embedding Components during the SLA Process

Techniques developed by the AMRC Design and Prototyping Group (DPG) have increased additive manufacturing’s potential applications to include embedded components.

DPG researchers set themselves the challenge of creating an additively manufactured product with a component that had not been additively manufactured inside.

They used stereolithography (SLA) to create a USB memory stick by building the case around the circuitry instead of having to make it in two halves and then join them together once the circuit had been placed inside.